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Kulicke & Soffa to Exhibit at SEMICON China 2019

SINGAPORE–(BUSINESS WIRE)–lt;a href="https://twitter.com/search?q=%24KLIC&src=ctag" target="_blank"gt;$KLIClt;/agt; lt;a href="https://twitter.com/hashtag/SEMICON?src=hash" target="_blank"gt;#SEMICONlt;/agt;–Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC) (“Kulicke & Soffa”, “K&S”
or the “Company”), announced today that it will be exhibiting at the
SEMICON China 2019 trade show in Shanghai, China, from March 20 to 22.

The new ATPremier™ LITE wafer level bonder will debut at the
trade show along with Kulicke & Soffa’s latest range of assembly and
packaging solutions. The new ATPremier™ LITE wafer bumping system, under
the Power Series platform, offers a cost-of-ownership advantage,
delivering high productivity with increased efficiency. The system is
also compatible with an Automatic Wafer Handler system to enable factory
automation.

Other recently introduced, K&S’s solution such as the RAPID™ MEM
GEN-S series ball bonder, Asterion™ hybrid wedge
bonder and high performance PowerFusion™ TL wedge bonder
will also be showcased. A system-in-a-package (SiP) line featuring the
K&S iFlex T2 PoP equipment along with a screen printer and an
automatic optical inspection system, will demonstrate a full solution
for package-on-package interconnect. The Company will also be
demonstrating the capability of its KNet PLUS connectivity
software designed to connect all K&S equipment and other SECS-II/GEM
compliant equipment.

Nelson Wong, Kulicke & Soffa’s Senior Vice President of Ball Bonder
Business Unit, said, “With the rise of smart automation and connected
systems in the age of Industry 4.0, K&S continues to invest in R&D to
develop solutions which offer connectivity, intelligence and flexible
automation to help our customers enhance efficiency and to improve
productivity and reliability.”

Customers can see the full assembly of solutions at the SEMICON China
trade show in Shanghai, China, Hall N3, Booth #3411.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ:KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)

Contacts

Kulicke & Soffa Industries, Inc.
Marilyn Sim
Public
Relations
P: +65-6880-9309
F: +65-6880-9580
[email protected]

Kulicke & Soffa Industries, Inc.
Joseph Elgindy
Investor
Relations & Strategic Initiatives
P: +1-215-784-7500
F:
+1-215-784-6180
[email protected]