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Rudolph’s NovusEdge Selected by Leading Wafer Manufacturers for Bare Wafer Edge and Backside Inspection

Backlog for recently released system increases to over $12M

WILMINGTON, Mass.–(BUSINESS WIRE)–Rudolph Technologies, Inc. (NYSE: RTEC) today announced the receipt of
over $12M in new orders for its recently-released NovusEdge
system for edge and backside inspection on bare silicon wafers. The new
orders are for capacity expansions at our existing customers as well as
orders from two additional large wafer manufacturers based in Asia.
These orders are in addition to the $3M previously announced and will
ship throughout calendar year 2019.

“With these orders Rudolph has expanded its customer base to include the
top wafer suppliers with over 75% of the bare wafer market share,” said
Mike Plisinski, Rudolph Technologies’ CEO. “We believe the early
acceptance of these new systems is being driven by the accelerating
demand for high-quality bare silicon wafers for sub 20nm nodes. To meet
that demand customers require an inspection solution with increased
sensitivity on the wafer edge and backside. The Rudolph team worked
closely with bare wafer manufacturers in order to introduce a new
product with compelling capabilities and value of ownership. As the rate
of die shrinks slows at the advanced nodes, more wafers are required to
make enough die to meet growing market demand, especially for advanced
memory and logic chips.”

Chips and micro-fractures at the edge readily propagate as cracks into
active areas of the wafer, especially when the wafer is thinned.
Backside contamination can distort the frontside of the wafer during
lithography, consuming focus budgets that are already thin and will
become even thinner with the adoption of EUV lithography.

Edge and backside inspection have requirements that are very different
from conventional frontside inspection. The NovusEdge
EBI (Edge, Backside Inspection) system’s image-based approach provides
full coverage of near-edge, bevel and apex regions, both top and bottom.
Compared to existing technology, it is faster, more sensitive and better
at classifying types of defects, especially for the complex shapes and
curvatures at the notch. Backside inspection can use the same light
scattering techniques used on the frontside but requires special
handling capabilities to avoid contacting or contaminating the
frontside. In all cases, sophisticated software provides analysis and
automatic defect classification.

For more information about Rudolph’s process control solutions, visit www.rudolphtech.com.

About Rudolph Technologies
Rudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling microelectronic
device manufacturers to drive down costs and time to market of their
devices. Headquartered in Wilmington, Massachusetts, Rudolph supports
its customers with a worldwide sales and service organization.
Additional information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement
This press release contains
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995 (the “Act”) which include the benefit to
customers of Rudolph’s products, Rudolph’s business momentum and future
growth and the market demand for semiconductors generally as well as
other matters that are not purely historical data. Rudolph wishes to
take advantage of the “safe harbor” provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph’s control. Such factors include, but are not
limited to, Rudolph’s ability to plan and manage its resources and
production capability, including its supply chain and fluctuations in
customer capital spending. Additional information and considerations
regarding the risks faced by Rudolph are available in Rudolph’s Form
10-K report for the year ended December 31, 2017 and other filings with
the Securities and Exchange Commission. As the forward-looking
statements are based on Rudolph’s current expectations, the company
cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to
update the forward-looking information contained in this press release.

Contacts

Investors:
Michael Sheaffer
978.253.6273
[email protected]

Trade Press:
Sandy Fewkes
408.529.9685
[email protected]